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The
Materials Science
of
Thin
Films
I
I
I
The
Materials Science
of
Milton
Ohring
Stevens Institute
of
Technology
Department
of
Materials Science and Engineering
Hoboken, New Jersey
Academic
Press
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@
Copyright
0
1992
by Academic
Pres
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Library of
Congress
Cataloging-in-Publication
Data
Ohring. Milton,
date.
The
materials science of thin
films
/
Milton Ohring.
Includes
bibliograpbical
references
and
indcx.
ISBN
0-12-524990-X (Alk. paper)
1.
Thin
films.
I.
Title.
TA418.9.T45oQ7 1991
p.
cm.
620'.44-&20
91-9664
CIP
Printed in the United States
of
America
99
00
01
02
03
MV11
10
9
8 7
+
Contents
Foreword
xi
Preface
xiii
Acknowledgments
xvii
Thin Films
-
A
Historical Perspective
xix
Chapter
1
A
Review
of
Materials Science
1
1.1. Introduction
1
1.2. Structure
2
1.3. Defects in Solids
10
1.4. Bonding of Materials
14
1.5. Thermodynamics of Materials
21
1.6. Kinetics
33
1.7. Nucleation
40
1.8. Conclusion
43
Exercises
43
References
46
Chapter
2
Vacuum Science and Technology
49
2.1.
Kinetic Theory
of
Gases
49
2.2. Gas Transport and Pumping
55
V
vi
Contents
2.3.
Vacuum Pumps and Systems
62
Excercises
75
References
77
Chapter
3
3.1.
Introduction
79
Physical Vapor Deposition
79
3.2.
The Physics and Chemistry of Evaporation
81
3.3.
Film Thickness Uniformity and Purity
87
3.4.
Evaporation Hardware and Techniques
96
3.5.
Glow Discharges and Plasmas
101
3.6.
Sputtering
109
3.7.
Sputtering Processes
118
3.8.
Hybrid and Modified PVD Processes
132
Exercises
140
References
144
Chapter
4
Chemical Vapor Deposition
147
4.1.
Introduction
147
4.2.
Reaction Types
149
4.3.
Thermodynamics of CVD
155
4.4.
Gas Transport
162
4.5.
Growth Kinetics
167
4.6.
CVD Processes and Systems
177
Exercises
190
References
193
Chapter
5
Film Formation and Structure
195
5.1.
Introduction
195
5.2.
Capillarity Theory
198
5.3.
Atomistic Nucleation Processes
206
5.4.
Cluster Coalescence and Depletion
213
5.5.
Experimental Studies of Nucleation and Growth
219
5.6.
Grain Structure of Films and Coatings
223
5.7.
Amorphous Thin Films
234
Exercises
243
References
246
Contents
vii
Chapter
6
Characterization of Thin Films
249
6.1. Introduction
249
6.2. Film Thickness
252
6.3. Structural Characterization
265
6.4. Chemical Characterization
275
Exercises
300
References
305
Chapter
7
Epitaxy
307
7.1. Introduction
307
7.2. Structural Aspects of Epitaxial Films
310
7.3. Lattice Misfit and Imperfections in Epitaxial Films
316
7.4. Epitaxy of Compound Semiconductors
322
7.5. Methods for Depositing Epitaxial Semiconductor Films
331
7.6. Epitaxial Film Growth and Characterization
339
7.7. Conclusion
350
Exercises
351
References
353
Chapter
8
Interdiffusion and Reactions in Thin Films
355
8.1. Introduction
355
8.2. Fundamentals of Diffusion
357
8.3. Interdiffusion in Metal Alloy Films
372
8.4. Electromigration in Thin Films
379
8.5. Metal-Semiconductor Reactions
385
8.6. Silicides and Diffusion Barriers
389
Exercises
398
References
401
8.7. Diffusion During Film Growth
395
Chapter
9
Mechanical Properties
of
Thin Films
403
9.1. Introduction
403
9.2.
Introduction to Elasticity. Plasticity. and Mechanical Behavior
405
9.3. Internal Stresses and Their Analysis
413
9.4. Stress in Thin Films
420
9.5. Relaxation Effects in Stressed Films
432
viii
Contents
9.6.
Adhesion
439
Exercises
446
References
449
Chapter
10
Electrical and Magnetic Properties
of
Thin Films
451
10.1. Introduction to Electrical Properties of Thin Films
451
10.2. Conduction in Metal Films
455
10.3. Electrical Transport in Insulating Films
464
10.4. Semiconductor Contacts and MOS Structures
472
10.5.
Superconductivity in Thin Films
480
10.6.
Introduction to Ferromagnetism
485
Temperature
489
10.8. Magnetic Thin Films for Memory Applications
493
Exercises
502
References
505
10.7. Magnetic Film Size Effects
-
M,
versus Thickness and
Chapter
11
Optical Properties
of
Thin Films
507
11.1. Introduction
507
1 1.2. Properties of Optical Film Materials
508
1 1.3. Thin-Film Optics
524
1 1.4. Multilayer Optical Film Applications
531
Exercises
542
References
544
Chapter
72
Metallurgical and Protective Coatings
547
12.1. Introduction
547
12.2. Hard Coating Materials
551
12.3. Hardness and Fracture
561
12.4. Tribology of Films and Coatings
570
12.5. Diffusional, Protective, and Thermal Coatings
580
Exercises
585
References
587
Chapter
13
Modification
of
Surfaces and Films
589
13.1. Introduction
589
13.2. Lasers and Their Interactions with Surfaces
591
Contents
ix
13.3. Laser Modification Effects and Applications
602
13.4. Ion-Implantation Effects in Solids
609
13.5. Ion-Beam Modification Phenomena and Applications
616
Exercises
624
References
626
Chapter
14
Emerging Thin-Film Materials and Applications
629
14.1. Film-Patterning Techniques
630
14.2. Diamond Films
635
14.3. High-T, Superconductor Films
641
14.4. Films for Magnetic Recording
645
14.5. Optical Recording
650
14.6. Integrated Optics
654
14.7. Superlattices
661
14.8. Band-Gap Engineering and Quantum Devices
669
14.9. Conclusion
678
Exercises
678
References
681
Appendix
1
Physical Constants
685
Appendix
2
Selected Conversions
687
index
689
Foreword
It
is a distinct pleasure for me to write a foreword to this new textbook by my
long-time friend, Professor Milt Ohring.
There have been at least
200
books written on various aspects of thin film
science and technology, but this is the first true textbook, specifically intended
for classroom use in universities. In my opinion there has been a crying need
for a real textbook for a long time. Most thin film courses in universities have
had to use many books written for relatively experienced thin film scientists
and engineers, often supplemented by notes prepared by the course instructor.
The Materials Science
of
Thin
Films,
a true textbook, complete with
problems after each chapter, is available to serve as a nucleus for first courses
in thin film science and technology.
In addition to his many years of experience teaching and advising graduate
students at Stevens Institute of Technology, Professor Ohring has been the
coordinator of an on-premises, M.S. degree program offered by Stevens at the
AT&T Bell Laboratories in Murray Hill and Whippany, New Jersey. This
ongoing cooperative program has produced over sixty M.S. graduates to date.
Several of these graduates have gone on to acquire Ph.D. degrees. The
combination of teaching, research, and industrial involvement has provided
Professor Ohring with a broad perspective of thin film science and technology
and tremendous insight into the needs of students entering this exciting field.
His insight and experience are quite evident in this textbook.
John
L.
Vossen
xi
+
Preface
Thin-film science and technology play a crucial role in the high-tech industries
that will bear the main burden of future American competitiveness. While the
major exploitation of thin films has been in microelectronics, there are
numerous and growing applications in communications, optical electronics,
coatings of all kinds, and in energy generation and conservation strategies.
A
great many sophisticated analytical instruments and techniques, largely devel-
oped to characterize thin films and surfaces, have already become indispens-
able in virtually every scientific endeavor irrespective of discipline. When
I
was called upon to offer a course on thin films, it became a genuine source of
concern to me that there were no suitable textbooks available on this unques-
tionably important topic. This
book,
written with a materials science flavor, is
a response to this need. It is intended for
1.
2.
3.
Science and engineering students in advanced undergraduate or first-year
graduate level courses on thin films
Participants in industrial in-house courses or short courses offered by
professional societies
Mature scientists and engineers switching career directions who require an
overview of the field.
Readers should be reasonably conversant with introductory college chem-
istry and physics and
possess
a passive cultural familiarity with topics com-
monly treated in undergraduate physical chemistry and modem physics courses.
xiv
Preface
It is worthwhile to briefly elaborate on this book’s title and the connection
between thin films and the broader discipline of materials science and engineer-
ing. A dramatic increase in our understanding of the fundamental nature of
materials throughout much of the twentieth century has led to the development
of materials science and engineering. This period witnessed the emergence of
polymeric, nuclear, and electronic materials, new roles for metals and ceram-
ics, and the development of reliable methods to process these materials in bulk
and thin-film form. Traditional educational approaches to the study of materi-
als have stressed
structure-property
relationships in bulk solids, typically
utilizing metals, semiconductors, ceramics; and polymers, taken singly or
collectively as illustrative vehicles to convey principles. The same spirit is
adopted in this book except that
thin solid films
are the vehicle. In addition,
the basic theme has been expanded to include the multifaceted
processing-
structure-properties-performance
interactions. Thus the original science
core is preserved but enveloped by the engineering concerns of
processing
and
performance.
Within this context,
I
have attempted to weave threads
of
commonality among seemingly different materials and properties, as well as to
draw distinctions between materials that exhibit outwardly similiar behavior. In
particular, parallels and contrasts between films and bulk materials are recur-
ring themes.
An optional introductory review chapter on standard topics in materials
establishes a foundation for subsequent chapters. Following a second chapter
on vacuum science and technology, the remaining text is broadly organized
into three categories. Chapters
3
and
4
deal with the principles and practices of
film deposition from the vapor phase. Chapters
5-9
deal with the processes
and phenomena that influence the structural, chemical, and physical attributes
of films, and how to characterize them. Topics discussed include nucleation,
growth, crystal perfection, epitaxy, mass transport effects, and the role of
stress. These are the common thin-film concerns irrespective of application.
The final portion of the book (Chapters
10-14)
is largely devoted to specific
film properties (electrical, magnetic, optical, mechanical) and applications, as
well as to emerging materials and processes. Although the first nine chapters
may be viewed as core subject matter, the last five chapters offer elective
topics intended to address individual interests. It is my hope that instructors
using this book will find this division of topics a useful one.
Much of the book reflects what is of current interest to the thin-film research
and development communities. Examples include chapters on chemical vapor
deposition, epitaxy, interdiffusion and reactions, metallurgical and protective
coatings, and surface modification. The field is evolving
so rapidly that even
the classics of yesteryear, e.g., Maissel and Glang,
Handbook
of
Thin
Film
Preface
xv
Technology
(1970) and Chopra,
Thin Film Phenomena
(1969), as well as
more recent books on thin films, e.g., Pulker,
Coatings
on
Glass
(1984), and
Eckertova,
Physics
of
Thin Films
(1986),
make little or no mention of these
now important subjects.
As every book must necessarily establish its boundaries,
I
would like to
point out the following:
(1)
Except for coatings (Chapter
12)
where thicknesses
range from several to as much as hundreds of microns (1 micron or
1
pm
=
lop6
meter), the book
is
primarily concerned with films that are less
than 1 pm thick.
(2)
Only films and coatings formed from the gas phase by
physical
(PVD)
or chemical vapor deposition
(CVD)
processes are considered.
Therefore spin and dip coating, flame and plasma spraying of powders,
electrolytic deposition, etc., will not be treated.
(3)
The topic of polymer films
could easily justify a monograph of its own, and hence will not be discussed
here. (4) Time and space simply do not allow for development of all topics
from first principles. (Nevertheless,
I
have avoided using the unwelcome
phrase “It can be shown that
. . .
,”
and have refrained from using other
textbooks or the research literature to fill in missing steps of derivations.)
(5)
A
single set of units (e.g., CGS, MKS,
SI,
etc.) has been purposely avoided to
better address the needs of a multifaceted and interdisciplinary audience.
Common usage, commercial terminology, the research literature and simple
bias and convenience have all played a role in the ecumenical display
of
units.
Where necessary, conversions between different systems of units are provided.
At the end of each chapter are problems of varying difficulty, and
I
believe a
deeper sense of the subject matter will be gained by considering them. Three
very elegant problems (Le. 9-6,
-7,
-8)
were developed by Professor W.
D.
Nix, and
I
thank him for their use.
By emphasizing immutable concepts,
I
hope this book will be spared the
specter
of
rapid obsolescence. However, if
this
book will in some small
measure help spawn new technology rendering it obsolete, it will have served a
useful function.
Milton Ohring