Order Number: 323107-002US
Intel
®
Xeon
®
Processor
C5500/C3500 Series and LGA1366
Socket
Thermal/Mechanical Design Guide
August 2010
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
2 Order Number: 323107-002US
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER,
AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY
PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel
®
Xeon

®
Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
The code name “Picket Post" presented in this document are only for use by Intel to identify products, technologies, or services in
development, that have not been made commercially available to the public, i.e., announced, launched or shipped. They are not
commercial names for products or services and are not intended to function as trademarks.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2010, Intel Corporation.
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 3

Contents
1Introduction 8
1.1 Reference Documents 9
1.2 Definition of Terms 9
2 Package Mechanical Specifications 11
2.1 Package Mechanical Specifications 11
2.1.1 Package Mechanical Drawing 12
2.1.2 Processor Component Keep-Out Zones 15
2.1.3 Package Loading Specifications 15
2.1.4 Package Handling Guidelines 15
2.1.5 Package Insertion Specifications 15
2.1.6 Processor Mass Specification 16

2.1.7 Processor Materials 16
2.1.8 Processor Markings 16
2.1.9 Processor Land Coordinates 17
3 LGA1366 Socket 18
3.1 Board Layout 20
3.2 Attachment to Motherboard 21
3.3 Socket Components 21
3.3.1 Socket Body Housing 21
3.3.2 Solder Balls 21
3.3.3 Contacts 22
3.3.4 Pick and Place Cover 22
3.4 Package Installation / Removal 23
3.4.1 Socket Standoffs and Package Seating Plane 23
3.5 Durability 24
3.6 Markings 24
3.7 Component Insertion Forces 24
3.8 Socket Size 24
3.9 LGA1366 Socket NCTF Solder Joints 24
4 Independent Loading Mechanism (ILM) 26
4.1 Design Concept 26
4.1.1 ILM Cover Assembly Design Overview 26
4.1.2 ILM Back Plate Design Overview 27
4.2 Assembly of ILM to a Motherboard 28
5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications 31
5.1 Component Mass 31
5.2 Package/Socket Stackup Height 31
5.3 Socket Maximum Temperature 31
5.4 Loading Specifications 33
5.4.1 Board Deflection Guidance 33
5.5 Electrical Requirements 34

5.6 Environmental Requirements 35
6 Thermal Specifications 36
6.1 Package Thermal Specifications 36
6.1.1 Thermal Specifications 36
6.1.2 Thermal Metrology 47
6.2 Processor Thermal Features 48
6.2.1 Processor Temperature 48
6.2.2 Adaptive Thermal Monitor 48
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Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
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6.2.3 THERMTRIP# Signal 51
6.3 Platform Environment Control Interface (PECI) 51
6.3.1 Introduction 51
6.3.2 PECI Specifications 53
7Thermal Solutions 54
7.1 Performance Targets 54
7.2 Heat Pipe Considerations 56
7.3 Assembly 57
7.3.1 Thermal Interface Material (TIM) 58
7.4 Structural Considerations 58
7.5 Thermal Design 59
7.5.1 Thermal Characterization Parameter 59
7.5.2 NEBS Thermal Profile 60
7.5.3 Power Thermal Utility 61
7.6 Thermal Features 61

7.6.1 Fan Speed Control 61
7.6.2 PECI Averaging and Catastrophic Thermal Management 62
7.6.3 Intel
®
Turbo Boost Technology 62
7.6.4 Absolute Processor Temperature 63
7.6.5 Custom Heat Sinks For UP ATCA 63
8 Quality and Reliability Requirements 66
8.1 Use Conditions 66
8.2 Intel Reference Component Validation 67
8.2.1 Board Functional Test Sequence 67
8.2.2 Post-Test Pass Criteria 68
8.2.3 Recommended BIOS/Processor/Memory Test Procedures 68
8.3 Material and Recycling Requirements 68
A Component Suppliers 70
B Mechanical Drawings 72
C Socket Mechanical Drawings 89
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 5

Figures
1-1 Intel
®
Xeon
®

Processor C5500/C3500 Series Socket Stack-up 8
2-1 Processor Package Assembly Sketch 11
2-2 Processor Package Drawing (Sheet 1 of 2) 13
2-3 Processor Package Drawing (Sheet 2 of 2) 14
2-4 Processor Top-Side Markings 16
2-5 Processor Land Coordinates and Quadrants, Bottom View 17
3-1 LGA1366 Socket with Pick and Place Cover Removed 18
3-2 LGA1366 Socket Contact Numbering (Top View of Socket) 19
3-3 LGA1366 Socket Land Pattern (Top View of Board) 20
3-4 Attachment to Motherboard 21
3-5 Pick and Place Cover 22
3-6 Package Installation / Removal Features 23
3-7 LGA1366 NCTF Solder Joints 25
4-1 ILM Cover Assembly 27
4-2 Back Plate 28
4-3 ILM Assembly 29
4-4 Pin1 and ILM Lever 30
5-1 Socket Temperature Measurement Location 32
5-2 Flow Chart of Knowledge-Based Reliability Evaluation Methodology 35
6-1 Intel
®
Xeon
®
Processor EC5549 and EC5509 Thermal Profile 37
6-2 Intel
®
Xeon
®
Processor EC3539 and EC5539 Thermal Profile 39
6-3 Intel

®
Xeon
®
Processor LC5528 Thermal Profile 40
6-4 Intel
®
Xeon
®
Processor LC5518 Thermal Profile 42
6-5 Intel
®
Celeron® Processor P1053 Thermal Profile 43
6-6 Intel
®
Xeon
®
Processor LC3528 Thermal Profile 44
6-7 Intel
®
Xeon
®
Processor LC3518 Thermal Profile 46
6-8 TTV Case Temperature (TCASE) Measurement Location 47
6-9 Frequency and Voltage Ordering 49
7-1 1U Heatsink Performance Curves 55
7-2 ATCA Heatsink Performance Curves 56
7-3 TTV Die Size and Orientation 57
7-4 1U Reference Heatsink Assembly 57
7-5 Processor Thermal Characterization Parameter Relationships 59
7-6 NEBS Thermal Profile 60

7-7 UP ATCA Thermal Solution 64
7-8 UP ATCA System Layout 64
7-9 UP ATCA Heat Sink Drawing 65
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) 73
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) 74
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) 75
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) 76
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) 77
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) 78
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) 79
B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) 80
B-9 Heatsink Shoulder Screw (1U, 2U, and Tower) 81
B-10 Heatsink Compression Spring (1U, 2U, and Tower) 82
B-11 Heatsink Retaining Ring (1U, 2U, and Tower) 83
B-12 Heatsink Load Cup (1U, 2U, and Tower) 84
B-13 ATCA Reference Heatsink Assembly (Sheet 1 of 2) 85
B-14 ATCA Reference Heatsink Assembly (Sheet 2 of 2) 86
B-15 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) 87
B-16 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) 88
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
6 Order Number: 323107-002US
C-1 Socket Mechanical Drawing - (Sheet 1 of 4) 90
C-2 Socket Mechanical Drawing - (Sheet 2 of 4) 91
C-3 Socket Mechanical Drawing - (Sheet 3 of 4) 92
C-4 Socket Mechanical Drawing - (Sheet 4 of 4) 93

Tables
1-1 Reference Documents 9
1-2 Terms and Descriptions 9
2-1 Processor Loading Specifications 15
2-2 Package Handling Guidelines 15
2-3 Processor Materials 16
5-1 Socket Component Mass 31
5-2 1366-land Package and LGA1366 Socket Stackup Height 31
5-3 Socket and ILM Mechanical Specifications 33
5-4 Electrical Requirements for LGA1366 Socket 34
6-1 Intel
®
Xeon
®
Processor EC5549 and EC5509 Thermal Specifications 37
6-2 Intel
®
Xeon
®
Processor EC5549 and EC5509 Thermal Profile 38
6-3 Intel
®
Xeon
®
Processor EC3539 and EC5539 Thermal Specifications 38
6-4 Intel
®
Xeon
®
Processor EC3539 and EC5539 Thermal Profile 39

6-5 Intel
®
Xeon
®
Processor LC5528 Thermal Specifications 40
6-6 Intel
®
Xeon
®
Processor LC5528 Thermal Profile 41
6-7 Intel
®
Xeon
®
Processor LC5518 Thermal Specifications 41
6-8 Intel
®
Xeon
®
Processor LC5518 Thermal Profile 42
6-9 Intel
®
Celeron
®
Processor P1053 Thermal Specifications 43
6-10 Intel
®
Celeron
®
Processor P1053 Thermal Profile 43

6-11 Intel
®
Xeon
®
Processor LC3528 Thermal Specifications 44
6-12 Intel
®
Xeon
®
Processor LC3528 Thermal Profile 45
6-13 Intel
®
Xeon
®
Processor LC3518 Thermal Specifications 45
6-14 Intel
®
Xeon
®
Processor LC3518 Thermal Profile 46
6-15 GetTemp0() Error Codes 53
7-1 Boundary Conditions and Performance Targets 54
7-2 Fan Speed Control, TCONTROL and DTS Relationship 61
7-3 TCONTROL Guidance 62
8-1 Server Use Conditions Environment (System Level) 66
8-2 Server Use Conditions Environment (System Level) 67
A-1 Heatsinks and Thermal Interface Material 70
A-2 LGA1366 Socket and ILM Components 71
B-1 Mechanical Drawing List 72
C-1 Mechanical Drawing List 89

Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 7

Revision History
§ §
Revision Number Description Revision Date
002
Modified Table 5-3, Socket and ILM Mechanical Specifications
Modified Section 7.6.1, Fan Speed Control
August 2010
001 First release February 2010
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 8

Introduction
1 Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for processors in the Picket Post platform. The components described in this document
include:
• The processor thermal solution (heatsink) and associated retention hardware.

• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Other processor specifications are provided in the Intel
®
Xeon
®
Processor C5500/
C3500 Series Datasheet.
Figure 1-1. Intel
®
Xeon
®
Processor C5500/C3500 Series Socket Stack-up
Heatsink
Socket and ILM
Back Plate
Introduction
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
9 Order Number: 323107-002US
1.1 Reference Documents
Material and concepts in the following documents may be beneficial when reading this
document.

Notes:
1. See />2. See />3. Available at
4. Available at />1.2 Definition of Terms
Table 1-1. Reference Documents
Document Document# Notes
European Blue Angel Recycling Standards 3
Intel
®
Xeon
®
Processor C5500/C3500 Series Datasheet, Volume 1 323103 1
Intel
®
Xeon
®
Processor C5500/C3500 Series Datasheet, Volume 2 323317 1
Intel
®
Xeon
®
Processor 5500 Series Mechanical Model 321326 2
Intel
®
Xeon
®
Processor 5500 Series Thermal Model 321327 2
Entry-level Electronics Bay Specification 4
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a

duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
IMON The current monitor input to the CPU. The VRM tells the CPU how much current it is
drawing.
LGA1366 socket The processor mates with the system board through this surface mount, 1366-land
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
CASE
– T
LA
) / Total
Package Power. Heat source should always be specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (T

CASE
– T
S
) / Total
Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
T
CASE
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 10


Introduction
§
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
T
CONTROL
T
control
is a static value below TCC activation used as a trigger point for fan speed
control.
TDP Thermal Design Power: Thermal solution must be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.

Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 11

Package Mechanical Specifications
2 Package Mechanical
Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 2-1 shows a sketch
of the processor package components and how they are assembled together. See
Section 3 and Section 4.
The package components shown in Figure 2-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
Figure 2-1. Processor Package Assembly Sketch

IHS
Substrate

LGA1366 Socket
System Board

Capacitors


TIM
IHS
Substrate

LGA

System Board

Capacitors

Die
TIM
Package Mechanical Specifications
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
12 Order Number: 323107-002US
2.1.1 Package Mechanical Drawing

The package mechanical drawings are shown in Figure 2-2 and Figure 2-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm
Intel
®
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®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 13

Package Mechanical Specifications
Figure 2-2. Processor Package Drawing (Sheet 1 of 2)
8 7 6 5 4 3 2
H
G
F
E
D
C
B
A
8 7 6 5 4 3 2 1
H

G
F
E
D
C
B
A
A
A
R
D
E
C
C
4X RM
1
M
2
M
3
F
4
F
2
B
1
C
1
C
3

B
2
C
2
C
4
G
2
G
1
H
1
H
2
J
1
J
2
0.02

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
D76126 1 7
DWG. NO SHT. REV

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
D76126 1 7
DWG. NO SHT. REV
DEPARTMENT

2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
TITLE
EMTS DRAWING
SIZE DRAWING NUMBER REV
A1 D76126 7
SCALE: 2:1
DO NOT SCALE DRAWING
SHEET 1 OF 2
FINISHMATERIAL
DATEAPPROVED BY
DATECHECKED BY
DATEDRAWN BY
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0
ANGLES ± 0.5
THIRD ANGLE PROJECTION
SEE DETAIL B
SEE DETAIL B
SEE DETAIL B
SEE DETAIL B
IHS LID
SEE DETAIL B
PIN 1

SEE DETAIL C
PIN 1
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P

N
M
L
K
J
H
G
F
E
D
C
B
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
SEE DETAIL A
SECTION A-A
DETAIL A
SCALE 20:1
PACKAGE SUBSTRATE IHS SEALANT
IHS LID
DETAIL
C
SCALE 20:1
DETAIL B
SUBSTRATE ALIGNMENT FIDUCIAL
X5
SCALE 35:1
SYMBOL
MILLIMETERS

COMMENTS
MIN MAX
B
1
44.93 45.07
B
2
42.43 42.57
C
1
38.9 39.1
1CE
C
2
36.4 36.6
1CD
C
3
2.2 2.3
C
4
2.2 2.3
F
2
4.377 4.757
F
4
2.498 2.896
G
1

42.672 BASIC
G
2
40.64 BASIC
H
1
21.336 BASIC
H
2
20.32 BASIC
J
1
1.016 BASIC
J
2
1.016 BASIC
M
1
0.19 0.23
M
2
0.88 0.96
M
3
0.53 0.61
0.203
0.08
0.203 C
0.203 C D E
0.071 C

0.05
0.203 C
Package Mechanical Specifications
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
14 Order Number: 323107-002US
Figure 2-3. Processor Package Drawing (Sheet 2 of 2)
H
G
F
E
D
C
B
A
H
G
F
E
D
C
B
A
8 7 6 5 4 3 2
8 7 6 5 4 3 2 1
R

H
H
H
C
9.455
7.2
1.06 MAX
COMPONENT HEIGHT
T
1
T
2
V
1
V
2
2X 36.5
2X 39
14.4
18.91
E
G
E
G

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.

D76126 2 7
DWG. NO SHT. REV
DEPARTMENT
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
SIZE DRAWING NUMBER REV
A1 D76126 7
SCALE: 2:1
DO NOT SCALE DRAWING
SHEET 2 OF 2
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
SEE DETAIL D
SEE DETAIL E
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG

AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
DETAIL D
SCALE 15:1
0.23 C H E
M N

NM
R
2
DETAIL
E
SCALE 15:1
0.23 C H G
J K
KJ
R
1
4X
SURFACE
TEST PAD AREA
SYMBOL
MILLIMETERS
COMMENTS
MIN MAX
R
1
R1.09
R
2
R1.09
T
1
0.2
T
2
11.7

V
1
0.2
V
2
11.7
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 15

Package Mechanical Specifications
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Do not contact the Test Pad Area with
conductive material. Decoupling capacitors are typically mounted to either the topside
or land-side of the package substrate. See Figure 2-2 and Figure 2-3 for keep-out
zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
2.1.3 Package Loading Specifications
Table 2-1 provides load specifications for the processor package. These maximum
limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Exceeding these limits during test may result in component
failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.
.

Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism
(ILM).
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package constrained by the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
2.1.4 Package Handling Guidelines
Table 2-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from a LGA1366 socket 15 times. The
socket should meet the LGA1366 requirements detailed in Section 5.
Table 2-1. Processor Loading Specifications
Parameter Maximum Notes
Static Compressive Load 890 N [200 lbf] 1, 2, 3
Dynamic Compressive Load 1779 N [400 lbf] [max static
compressive + dynamic load]
1, 3, 4
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended
Shear 70 lbs
Tensile 25 lbs
Torque 35 in.lbs
Package Mechanical Specifications
Intel
®
Xeon

®
Processor C5500/C3500 Series and LGA1366 Socket
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2.1.6 Processor Mass Specification
The typical mass of the processor is 35 grams. This mass [weight] includes all the
components that are included in the package.
2.1.7 Processor Materials
Table 2-3 lists some of the package components and associated materials.

2.1.8 Processor Markings
Figure 2-4 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-4. Processor Top-Side Markings
GRP1LINE1
GRP1LINE2
G2L1
G2L2
G3L1
G3L2
Legend: Mark Text (Engineering Mark):
GRP1LINE1: INTEL{M}{C}’YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES XXXXX
GRP1LINE4: FORECAST-NAME

GRP1LINE5: {FPO} {e4}
Legend: Mark Text (Production Mark):
GRP1LINE1: INTEL{M}{C}’YY PROC#
GRP1LINE2: SUB-BRAND
GRP1LINE3: SSPEC XXXXX
GRP1LINE4: SPEED/CACHE/INTC
GRP1LINE5: {FPO} {e4}
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
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Package Mechanical Specifications
2.1.9 Processor Land Coordinates
Figure 2-5 shows the bottom view of the processor land coordinates. The coordinates
are referred to throughout the document to identify processor lands.
.
§
Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View
Intel
®
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®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
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LGA1366 Socket
3 LGA1366 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
Intel
®
Xeon
®
processor C5500/C3500 series in the Picket Post platform. The socket
provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed
about a cavity in the center of the socket with lead-free solder balls for surface
mounting on the motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43 x 41
grid array with 21 x 17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Section 5.
Figure 3-1. LGA1366 Socket with Pick and Place Cover Removed
socket
cavity
package socket
cavity
package
LGA1366 Socket
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket

Thermal/Mechanical Design Guide August 2010
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Figure 3-2. LGA1366 Socket Contact Numbering (Top View of Socket)
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
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LGA1366 Socket
3.1 Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. There is no round-off (conversion) error between socket pitch (1.016 mm)
and board pitch (40 mil) because these values are equivalent.
In general, metal defined (MD) pads perform better than solder mask defined (SMD)
pads under thermal cycling, and SMD pads perform better than MD pads under
dynamic stress. Recommendations for pad definition on a per pad basis do not exist for
the LGA1366 socket.
The 40 mil spacing results in a reduced drill keepout as compared to previous
platforms. Drill keepout is explained in section 3.2.1 of the Intel
®
Xeon
®
5500 Platform
Design Guide (PDG). Select PCB suppliers are capable of producing 40 mil spacing.
Figure 3-3. LGA1366 Socket Land Pattern (Top View of Board)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB

1
3
7
5
9
11
15
13
17
19
23
21
25
27
31
29
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3
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31
29
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30
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30
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25
26
32
28
27
31
29
30
33
34
40
36
35

39
37
38
41
42
43
LGA1366 Socket
Intel
®
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®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
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3.2 Attachment to Motherboard
The socket is attached to the motherboard by 1366 solder balls. There are no additional
external methods (i.e. screw, extra solder, adhesive, etc.) to attach the socket. As
indicated in Figure 3-4, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
3.3 Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. See Appendix C for detailed drawings.
3.3.1 Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260°C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in Section 8.
The color of the housing will be dark as compared to the solder balls. This provides the
contrast needed for pick and place vision systems.
3.3.2 Solder Balls

A total of 1366 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217°C. The alloy must be
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.
Figure 3-4. Attachment to Motherboard
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
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LGA1366 Socket
3.3.3 Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
3.3.4 Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260° C for 40 seconds (typical reflow/rework profile) and the conditions
listed in Section 6 without degrading.

As indicated in Figure 3-5, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in Figure 3-5, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
Figure 3-5. Pick and Place Cover
LGA1366 Socket
Intel
®
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®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
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3.4 Package Installation / Removal
As indicated in Figure 3-6, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
.

3.4.1 Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 5.2 for the calculated IHS height above the motherboard.
Figure 3-6. Package Installation / Removal Features
alignment
walls
orientation
notch
orientation
post
access
Pin1 triangle
Pin1 chamfer
alignment
walls
orientation
notch
orientation
post
access
Pin1 triangle
Pin1 chamfer
Intel
®
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®
Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide

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LGA1366 Socket
3.5 Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from Table 5-4 must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
3.6 Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260° C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
3.7 Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
3.8 Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keep-
out drawings provided in Appendix B to ensure compatibility with the reference thermal
mechanical components.
3.9 LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The processor

signals at NCTF locations are typically redundant ground or non-critical reserved, so the
loss of the solder joint continuity at end of life conditions will not affect the overall
product functionality. Figure 3-7 identifies the NCTF solder joints.
LGA1366 Socket
Intel
®
Xeon
®
Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
25 Order Number: 323107-002US
.
Note: For platforms supporting the DP processor land C3 is CTF.
§
Figure 3-7. LGA1366 NCTF Solder Joints
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB
1
3
7
5
9
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15
13
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21
25

27
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29
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30
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20

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